This grant is enabling us to develop a new imaging module for Vector capable of measuring entire wafers. This unlocks Vector’s high-throughput measurement potential for industrial applications and means that we can work directly on customer wafers, no dicing or cutting necessary.
This new module can already measure whole wafers up to 4” in diameter and 12” is on our roadmap! So, if you want to see how our whole wafer measurements can solve your nano and microscale measurement challenges please get in touch.
